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Development Strategy of 3D Sensor Unicorn Orbbec

July 2019 | 29 pages | ID: DC85CAF1FE8EN
Market Intelligence & Consulting Institute (MIC)

US$ 2,000.00

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Orbbec, a startup headquartered in Shenzhen of China and dedicated to 3D sensing technology development, has the world&'s third-largest number of patents related to 3D sensing. With more than 2000 enterprise customers, this company has caught the attention of several venture capitalists and has become a unicorn firm with valuations greater than US$1 billion. This report analyzes Orbbec&'s development milestones, product portfolio, business operations, secretes behind its success, and strategic plans.
1. DEVELOPMENT MILESTONES

2. ORBBEC'S PRODUCT PORTFOLIO

2.1 3D Sensing Devices
  2.1.1 ASIC Chip
  2.1.2 Embedded Module
  2.1.3 3D Camera
2.2 Solutions for Different Industries
  2.2.1 3D Sensing Solutions for Different Industries Exhibited at CES 2019

3. BUSINESS PERFORMANCE

3.1 First Chinese Company to Supply Front-facing Structure Light 3D Module for Android Smartphones
3.2 Industry 3D Vision Sensor Services Cover 70% of Robot Companies Worldwide

4. KEY TO SUCCESS

4.1 Provide Comprehensive One-stop Solution with Independent 3D Patent Rights
4.2 Focus on Consumer Market and Smartphone Applications
4.3 Work with Strategic Investors to Compensate for Weaknesses

5. FUTURE STRATEGIES AND PLANS

5.1 Continue to Focus on Consumer 3D Sensing Products While Tapping into World-facing Application Markets
5.2 Increase Diversity of Industrial 3D Sensing Products to Become Leading AIoT Sensor Vendor

6. MIC PERSPECTIVE

APPENDIX

Glossary of Terms

LIST OF COMPANIES

ADI
Alibaba
ams AG
Ant Financial
Apple
Baidu
Bosch
Cowell
Eventec
Finisar
Foxconn
Genius
GF Xinde Investment
GloFo
Gloke Blueway Technology
Gold Stone Investment
Green Pine Capital Partners
Hadilao
Himax
HP
Huawei
Infineon
Intel
IQE
Keenon
KFC
Largan
LG Innotek
Lumentum
Mantis Vision
MediaTek
Microsoft
Ofilm
Oppo
Orbbec
OrinStar
OVT
Panasonic
Ping An Insurance Group
PTOT
Q Technology
Qualcomm
RPC Photonics
Megvii
SAIF Partners
Sandi Zhiyi
Sense Time
Sesame Credit
Shandong Cable TV
Sharp
Sony
STM
Sunny Optical
TI
Truly Opto-electronics
TSMC
UBTech
Viavi
Win Semiconductor
Xinde Investment
Yu'ebao
Yunji Technology

LIST OF TABLES

FTable 1 Orbbec's Corporate Milestones
Table 2 Specifications of Orbbec's ASIC Chips
Table 3 Specifications of Orbbec's Embedded Modules
Table 4 Orbbec's 3D Sensing Solutions
Table 5 Orbbec's 3D Sensing Solutions at CES 2019
Table 6 Android Smartphones with Front-facing 3D Sensing Module

LIST OF FIGURES

Figure 1 Orbbec's 3D Sensing Technology and Products
Figure 2 Orbbec's Astra-series 3D Cameras
Figure 3 Oppo Find X with Orbbec's Astra P 3D Module
Figure 4 3D Sensing Supply Chain of iPhones
Figure 5 HP Z 3D Camera with Orbbec's Astra mini S 3D Module
Figure 6 Use Cases of Chinese Robotics Companies Adopting Orbbec's 3D Sensing Modules
Figure 7 Development of Ant Financial's Facial Recognition Payment System
Figure 8 3D Fitting Room by Sandi Zhiyi
Figure 9 Orbbec's Smart Home Solutions


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